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Student Travel Support

ACM & SIGSOFT are offering travel fund support for students (undergrads and grads) to participate at MODELS 2018 Conference in Copenhagen.

If you are a student coming to MODELS 2018, please consider applying for this travel fund!

Application deadline: August 19th, 2018

Apply here: https://awards.sigsoft.org/CAPS/

More information can be found here: https://www.sigsoft.org/resources/caps.html